Vieworks Showcases High-Speed CoaXPress-over-Fiber Solution at SPIE Photonics West 2026
2026-01-22
At SPIE Photonics West 2026, Vieworks introduced a range of advanced imaging solutions that address the growing demands for speed, sensitivity, and precision in high-end inspection applications. As one of the most influential events in the photonics and imaging industry, the exhibition provided an ideal platform for engaging with global experts and technology leaders.
A key highlight was the demonstration of UV wafer crack inspection using the VTS-9K5X2-UV, a back-side illuminated (BSI) TDI line scan camera. Designed for enhanced sensitivity, the BSI structure makes the camera particularly suitable for highly demanding inspection environments such as semiconductor wafer inspection. Vieworks also unveiled its ultra-high-speed CoaXPress-over-Fiber 100G camera lineup, including the VC-21MHF and VTS-8K5HF models. Leveraging fiber optic connectivity, these cameras support significantly longer transmission distances while maintaining exceptionally high data throughput, addressing the increasing need for both speed and system flexibility.
Through its participation, Vieworks demonstrated its continued focus on pushing technological boundaries and delivering forward-looking machine vision solutions for next-generation industrial applications.
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